Product design
- Layer count: 32L (processing difficulty: layer to layer registration)
- Material: MM (processing difficulty: hole metallization)
- Board thickness: 6.4 mm
- Finishing Size: 3.2x17.3inch
- Aspect ratio :13:1 (processing difficulty: Plating )
- Min hole size/drill size:0.5/0.5mm
- Min Line width/Spacing :6/6mil
- Backdrilling Stub: ≤16mil (processing difficulty: uniform thickness)
- Impedance: ±8% (processing difficulty: uniform line and dielectric thickness)
Product application
Storage products are mainly used in bank、large enterprise、airport for big-date storage
| Surface Finishes |
| Electroless Nickel Immersion Gold (ENIG) |
| Hot Air Solder Level (HASL, Lead and Lead‐free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
| Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
| 2.36/2.36mil | 2.0/2.0mil | NPth Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
| 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
| Min：0.2mm | Min：0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil | Max. Test Points/Board(Universal ET) | Bed of Nail Test：16000 | NA |
| Min：0.1mm | Min：0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test：1-∞ | ||
| Min：0.45mm | Min：0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
| 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°、30°、45° | NA |
| 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
| 8:01 | 10:01 | Min.Solder Mask Dam Width | Green Oil：3mil | Green Oil：2.5mil | |||
| ±20% | ±10% | Other：4.5mil | Other：4mil | ||||
| ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |